For PLCC-254 packaged chips, ShenzhenHiseecon provides professional customized test fixture solutions, a key tool for verifying the performance of this type of chip. The following is a detailed introduction:

I. Introduction: Core Application Scenarios of PLCC-254 Test Fixtures

PLCC (Plastic Leaded Chip Carrier) is a classic surface-mount package form, with leads extending from the periphery of the chip and bent inwards in a "J" shape. PLCC-254 typically refers to a package specification with a lead pitch of 1.27mm (0.05 inches, equivalent to 254/100 mm), which is the mainstream standard in the PLCC package family. These chips have been widely used in industrial controllers, communication base stations, memory modules, and other scenarios with certain requirements for reliability and heat dissipation.
Shenzhen Hiseecon Technology Co., Ltd. (founded in 2013) is a company specializing in semiconductor test solutions, providing full-process services from chip design verification to mass production testing. For PLCC-254 packaged chips that are either discontinued or still in production, Hiseecon's customized test sockets, aging sockets, or programming fixtures are core tools for chip refurbishment screening, repair verification, and R&D debugging. By working with ATE testing equipment or programmers, these fixtures can perform functional verification, aging tests, and program programming on the chips, ensuring their performance and reliability during secondary use.

II. Product Details: Five Core Features

Based on Hiseecon's experience in customized test sockets, its PLCC-254 test fixture possesses the following core features:

1. Precise Adaptation to PLCC Package: Specifically designed for PLCC-254 (1.27mm standard pitch) packaged chips, the number of pins can be customized according to specific models (e.g., 32-pin, 44-pin, etc.), ensuring accurate pin contact.

2. Reliable and Stable Contact Performance: Utilizing a manual flip-top or double-clasp structure for convenient operation; the upper IC pressure plate adopts a spin-press design, ensuring smooth downward pressure and uniform chip pressure without displacement. 3. High-Quality Materials and Wide Temperature Range: Constructed with high-performance engineering plastics such as LCP/PEEK, it boasts excellent high-temperature resistance and insulation properties. The operating temperature range is -55°C to +175°C, meeting the testing environment requirements of chips ranging from consumer-grade to automotive-grade.

4. Flexible Customization and Multi-Scenario Applicability: Customizable as a test socket, aging socket, or programming socket according to customer needs, for functional verification, high-temperature aging testing, or program programming scenarios. Supports conversion of PLCC packages to DIP interfaces for easy connection to general-purpose programmers or development boards.

5. Easy Maintenance and Controllable Costs: Test probes can be replaced individually. When probes reach the end of their service life or are accidentally damaged, the entire fixture does not need to be scrapped, simplifying maintenance and significantly reducing subsequent use and maintenance costs.